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Singapore consortia works on advanced packaging solutions

Read about how A*STAR’s Institute of Microelectronics consortium will tackle IOT demands by developing low-cost, high reliability and performance packaging for MEMs Wafer Level Chip Scale and Silicon Photonics. These new packaging solutions will certainly require new and innovative failure analysis techniques.

LatticeAx used to prepare GaN m-plane end facets

Researchers at Yale University developed a novel conductivity based selective electrochemical etching  to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For more information contact Ge Yuan,

LatticeGear introduces the NEW LatticeAx 225

The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″).  The new design enables magnification and focus to be changed without mechanical adjustments to the microscopes working distance. The perfect, indent and cleaving system with microscope vision for downsizing wafers and a wide variety of samples for analysis or further processing. READ MORE

LatticeAx 225 right side view

Cleaving Glass Slides

Cleaved glass slide
Cleaved glass slide

The glass slide above was cleaved with the LatticeAx 120. The LatticeAx produces clean edges without creating fractures. This method was used to prepare samples for further analysis using and AFM of samples mounted on the surface of the slide. 

This technique was used by researchers at Penn State to downsize a glass slide containing carefully prepared samples, after it was discovered that the slide was too tall for the analytical equipment into which it needed to be places. This saved the research teams days of extra labor to recreate samples on a new slide. Read More


Cleaving Photoresist

SEM image of Photoresist prepared with the LatticeAx
SEM image of Photoresist prepared with the LatticeAx

Photoresist, because it is soft, makes it difficult to cross section mechanically or with the FIB. The best solution is to cleave the sample and image it directly in the SEM. This makes the LatticeAx the perfect tool for sample preparation of photoresist cross sections. The resist structure is not changed in the process and the simple cleave is achieved in <5 minutes.

Cleaving a Die Attached to a Host Substrate

Cleaving Stacked Die
Cleaving Stacked Die

The original die was depackaged, too thin to handle any other way, the die was attached to a host substrate. The LatticeAx was used to downsize the sample in preparation for further processing. The indent was created on the host substrate. No special process was used to indent and cleave the sample.

Downsizing die to fit your Prober or SEM or FIB sample holder

Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk

Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the cleaving step was eliminated.  For thicker samples (or die on a host), a 2 step process, microline indent + 3-point cleave is used. These processes enable hard to prepare thin and thick back end samples to be prepared.

n-probe stub
Out-of-package samples prepared using the LatticeAx. Bottom right shows sample on n-prober stub.