Call us at Responding to seemingly insatiable consumer demands for smaller and more powerful devices, chip transistor density doubles every two years. Keeping pace with this drive to miniaturize components while increasing wafer size, LatticeGear specializes in state-of-the-art wafer cleaving tools and technology. Wide range of wafer cleaving tools ensures accuracy, every time A favored vendor accredited by […]
Category Archives: Cleaving
New Tungsten Scribers
New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
LatticeGear welcomes our newest distributor, MSE Supplies
DinoCapture Software Tips for LatticeAx 225 Users
Getting ready for online training I found some useful drawing tools I was not previously aware of. They include a cross-hair tool, cross-hair tool with reticule, and magnification calibrated measurement. Download the pdf using the link below. Let us know if you find these features useful too! Dinolite software for 225 Users
LatticeGear Joins Columbia University at the Frontiers of Nanoengineering!
Attendees and presenters at Columbia’s Nano Day poster session get a firsthand look at clean, fast and dry cleaving. LatticeAx at the Frontiers of Engineering
Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom
For Immediate Release Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ yong.sun@yale.edu Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.moyal@latticegear.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]
Join MITnano for Tool Talks and Workshop with LatticeGear
CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]
Cleaving in the NanoFab?
Interested in sample preparation in your cleanroom? Download a fun presentation on cleaving in the cleanroom. Cleaving in the nanofab?
LatticeGear Cleaving Demos @ Stanford SNF July 19
Downsizing Tempered Glass using the FlexScribe
I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….