LatticeGear has recently added new sizes to two of its popular products: the FlexScribe™ Station and the CleanBreak™ Pliers. LatticeGear now offers a FlexScribe300, a flatbed scriber that is large enough to work with 300 mm wafers. Like the original FlexScribe100, the FlexScribe300 includes a standard tungsten carbide cutting wheel for use with a variety […]
MIT’s Jaramillo group is integrating LatticeGear solutions into their wafer/sample preparation workflow for controlled, damage-free wafer downsizing that is critical to their device fabrication process. Hillsboro, OR; October 15, 2019. The Jaramillo Group at the Massachusetts Institute of Technology has adopted LatticeGear’s complete scribing and cleaving tool portfolio in support of their research on photonic […]
Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside […]
LatticeGear to Present at ESREF Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases. See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23 LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 […]
Visit LatticeGear at Hisol booth Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber DO NOT MISS, LatticeGear Luncheon Seminar Scribeless cleaving method for glass, sapphire, III-V, SiC and silicon. Surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible. Online Reservation Deadline […]
Visit booth 86 (Nano Technology Solutions) at http://imc19.com/ for live sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon.
Watch the latest from LatticeGear!
Watch the LatticeAx cleaving system cleanly cleave glass slides and very thin cover slips. Contact us with your application and we will send you a free cleaving gift.
The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements. Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber? CLICK Here to buy!
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]