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Coming to ISTFA? Visit LatticeGear’s CleaveLandia Booth 819

We are expecting to learn the latest in failure analysis techniques and tools at #ISTFA. LatticeGear invites you to CleaveLandia where you can see the latest in scribing and cleaving. For fun we will be taking photos and have bags of gold for the first 100 participants!

Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom

For Immediate Release   Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ yong.sun@yale.edu Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.moyal@latticegear.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]

Join MITnano for Tool Talks and Workshop with LatticeGear

CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]