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Coming to ISTFA? Visit LatticeGear’s CleaveLandia Booth 819

We are expecting to learn the latest in failure analysis techniques and tools at #ISTFA. LatticeGear invites you to CleaveLandia where you can see the latest in scribing and cleaving. For fun we will be taking photos and have bags of gold for the first 100 participants!

LatticeGear attends UK-China Emerging Technologies Conference

August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference James Watt South (JWS) Building (Room 375) PATENTED Backside Scribing – FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days We encourage you to bring your wafers and samples to try it out! For more information contact, efrat.moyal@latticegear.com