New in 2021, LatticeGear has a line of Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond scribers. The […]
Getting ready for online training I found some useful drawing tools I was not previously aware of. They include a cross-hair tool, cross-hair tool with reticule, and magnification calibrated measurement. Download the pdf using the link below. Let us know if you find these features useful too! Dinolite software for 225 Users
For obvious reasons, I have spent some time thinking about ways to provide remote training for our customers. I also want to improve our written materials. A few LatticeAx 420 users have asked questions about how to use the software drawing and text features. If you are interested in this document, send me an email […]
Attendees and presenters at Columbia’s Nano Day poster session get a firsthand look at clean, fast and dry cleaving. LatticeAx at the Frontiers of Engineering
We are expecting to learn the latest in failure analysis techniques and tools at #ISTFA. LatticeGear invites you to CleaveLandia where you can see the latest in scribing and cleaving. For fun we will be taking photos and have bags of gold for the first 100 participants!
MIT’s Jaramillo group is integrating LatticeGear solutions into their wafer/sample preparation workflow for controlled, damage-free wafer downsizing that is critical to their device fabrication process. Hillsboro, OR; October 15, 2019. The Jaramillo Group at the Massachusetts Institute of Technology has adopted LatticeGear’s complete scribing and cleaving tool portfolio in support of their research on photonic […]
For Immediate Release Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ firstname.lastname@example.org Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.email@example.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]
CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]
Interested in sample preparation in your cleanroom? Download a fun presentation on cleaving in the cleanroom. Cleaving in the nanofab?