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LatticeGear Offers New Sizes to Old Favorites

LatticeGear has recently added new sizes to two of its popular products: the FlexScribe™ Station and the CleanBreak™ Pliers. LatticeGear now offers a FlexScribe300, a flatbed scriber that is large enough to work with 300 mm wafers. Like the original FlexScribe100, the FlexScribe300 includes a standard tungsten carbide cutting wheel for use with a variety […]

Top Tips in Choosing the best Scribing Tool for your Business

The masters in scribing tool technology share their top tips in choosing the best scribing tool for your business. With so many scribing tools to choose from it’s difficult to know what the best fit is for you. At LatticeGear we have a wide range of tools for different industries. Whether you are a scientist, […]

Get the latest in wafer Cleaving technology with cleanroom compatible Benchtop tools from LatticeGear

Looking for wafer cleaving tools for your electronic substrates? LatticeGear’s cutting edge technology brings you the best in wafer cleaving benchtop equipment so you can ensure the highest quality cut and the most professional product. Cleaving wafers by hand is inefficient and inaccurate. Wafer cleaving tools from LatticeGear make cleaving, downsizing, and singulating easy. LatticeGear’s […]

Choose Modern Wafer Dicing Equipment to Guarantee Convenience, Precision and Accuracy

LatticeGear gear has become the leading name in the wafer dicing industry with our novel and fresh approach to developing our own benchtop tools. Suitable for any laboratory or cleanroom, these tools are a far cry from it’s previous counterparts which consisted of large, expensive and cumbersome pieces of machinery. Take advantage of the latest […]

Tomorrow’s Miniaturized Devices Need High-Precision Scribing Tools Today

Well aware that the best scribing tools and wafer cleaving methods are steered by substrate hardness and thickness, LatticeGear founder Janet Teshima knows that cleave quality is heavily dependent on scribe angle and depth, as well as the underlying crystal structure. That’s why LatticeGear’s sample preparation solutions focus on streamlining workflows while ensuring high levels […]

Latest-Generation Cleaving Tools Ensure Precision

As devices get slimmer and faster with each new launch, chip manufacturers are under pressure to produce smaller but more powerful components. With transistor density doubling every couple of years, LatticeGear is well aware that high-precision wafer cleaving tools are needed to keep pace with surging technology. Innovative wafer cleaving tools boost accuracy Working closely […]

Only the best Scribing Tools for Cutting-Edge Projects

Accurate sample preparation needs state-of-the-art scribing and cleaving tools. By creating carefully positioned weak points in substrates and wafers, innovative LatticeGear devices ensure that delicate (and expensive!) materials split exactly where required. What is a wafer or substrate? In the miniaturized world of electronics, a wafer (often called a substrate or slice) is a thin […]

High-accuracy Wafer Dicing Equipment from LatticeGear Ensures Top Quality Products

During almost a decade of ground-breaking work in the semiconductor field, LatticeGear developed an innovative line of benchtop tools. Cleanroom compatible, they are designed to handle a broad range of amorphous and crystalline substrates, including: Glass: thick, thin, fused quartz and tempered; Sapphire: used when optical transmission is required in the ultraviolet (above 200 nm) […]

Picking the Best Scribing Tools for Your Project

LatticeGear founder Janet Teshima is well aware that global markets are demanding smaller, faster and cheaper devices. Right in step with this trend, she focuses on developing innovative scribing and cleaving tools that speed up sample preparation. Innovative approach to state-of-the-art scribing tools Scribing is a high precision technique for creating deliberate weak points in […]