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Singapore consortia works on advanced packaging solutions

http://fbs.advantageinc.com/chipscale/jul-aug_2016/#56

Read about how A*STAR’s Institute of Microelectronics consortium will tackle IOT demands by developing low-cost, high reliability and performance packaging for MEMs Wafer Level Chip Scale and Silicon Photonics. These new packaging solutions will certainly require new and innovative failure analysis techniques.

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