New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]
http://fbs.advantageinc.com/chipscale/jul-aug_2016/#56 Read about how A*STAR’s Institute of Microelectronics consortium will tackle IOT demands by developing low-cost, high reliability and performance packaging for MEMs Wafer Level Chip Scale and Silicon Photonics. These new packaging solutions will certainly require new and innovative failure analysis techniques.