New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
Tag Archives: Failure Analysis
Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]
Singapore consortia works on advanced packaging solutions
http://fbs.advantageinc.com/chipscale/jul-aug_2016/#56 Read about how A*STAR’s Institute of Microelectronics consortium will tackle IOT demands by developing low-cost, high reliability and performance packaging for MEMs Wafer Level Chip Scale and Silicon Photonics. These new packaging solutions will certainly require new and innovative failure analysis techniques.