Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research […]
At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an […]
LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin […]
Here is a fun instructional video showing the downsizing of a (111) silicon wafer into quarters. We used the FlipScribe backside scribing machine. See also Cleaving a (111) silicon wafer along crystal planes
Optical and SEM images of etched TSVs. Note the clean cleave with mirror finish. The long cleave enables inspection of many vias. SEM image at 10kV in SE mode.
Photoresist, because it is soft, makes it difficult to cross section mechanically or with the FIB. The best solution is to cleave the sample and image it directly in the SEM. This makes the LatticeAx the perfect tool for sample preparation of photoresist cross sections. The resist structure is not changed in the process and […]
Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the […]