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See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19

IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018 Visit LatticeGear- Booth 86 (Nano Technology Solutions) At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and […]

LatticeAx used to prepare GaN m-plane end facets

Researchers at Yale University developed a novel conductivity based selective electrochemical etching  to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For […]