New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
Interested in sample preparation in your cleanroom? Download a fun presentation on cleaving in the cleanroom. Cleaving in the nanofab?
I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….
LatticeGear has you covered from all sides! Booth 220, Phoenix Convention Center October 30-31 Sign up for Tools of the Trade to get a Preview of our new products including the NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm) The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and […]
Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact firstname.lastname@example.org for a copy of the paper. First you may ask “Why implement a cleaving process in the cleanroom?”: Here is what the Operations Director of a National Nanofabrication Facility had to say, “Here at […]
When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur! LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to; decide which type of […]
The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements. Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber? CLICK Here to buy!
LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!” How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. […]
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]
LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017. Beaverton, Oregon, USA […]