CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]
Interested in sample preparation in your cleanroom? Download a fun presentation on cleaving in the cleanroom. Cleaving in the nanofab?
August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference James Watt South (JWS) Building (Room 375) PATENTED Backside Scribing – FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days We encourage you to bring your wafers and samples to try it out! For more information contact, firstname.lastname@example.org