Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact firstname.lastname@example.org for a copy of the paper.
First you may ask “Why implement a cleaving process in the cleanroom?”:
Here is what the Operations Director of a National Nanofabrication Facility had to say,
“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”
LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.
LatticeGear wishes to thank the University of Sydney (Ethel Cabrera Ilagan) and Penn State University for their assistance with this study.
Contact LatticeGear at email@example.com to get a copy of the paper.
Watch the LatticeAx cleaving system cleanly cleave glass slides and very thin cover slips.
Contact us with your application and we will send you a free cleaving gift.
When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!
LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to;
- decide which type of jaws to install (there are two types)
- install the cleaving jaws,
- cleave a sample (glass and silicon) and
- remove and replace jaws when they are worn out
For small samples (<15 mm) use LatticeGear’s small sample cleaving pliers
The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements.
Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber?
CLICK Here to buy!
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization. This type of lecture is not part of any curriculum, yet fundamental for research and development.
It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material. While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.
Please contact LatticeGear at firstname.lastname@example.org if you would like to schedule a seminar at your industrial or academic laboratory.
LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”
How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: email@example.com
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.
Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.
LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research
LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.
Beaverton, Oregon, USA June 27, 2017: LatticeGear LLC has selected Hong Kong Guangdong International Co., Ltd. (GHITC) to represent and distribute their innovative cleaving and scribing solutions in China. Hong Kong Guangdong International Co. Ltd. is LatticeGear’s fifth sale channel partner in Asia-Pacific, further reinforcing LatticeGear’s commitment to providing excellent and timely customer support to this region.
“We are very excited to introduce our new partner at IPFA 2017,” said Efrat Moyal, Co-Founder of LatticeGear. “Hong Kong Guangdong International Co., Ltd. has a very strong background in both semiconductor failure analysis and electron microscopy. Their ability to relate to customer challenges when it comes to preparing a variety of samples will be a great asset for not only identifying the best solutions for a particular use case, but also for helping customers improve their sample preparation success rates.”
“It is our pleasure to cooperate with LatticeGear to bring high quality, high accuracy, yet very easy to use cleaving and scribing systems to China,” states Michael Heng, Sales Director at Hong Kong Guangdong International Co. Ltd. “We expect that the LatticeGear systems will be in demand in China for sample preparation because they are cleanroom compatible, high accuracy and offer reproducibility for routine tasks, all at a price that is affordable for most customers.”
Visit LatticeGear in Stand 40 at IPFA 2017, 4-7 July 2017, in Chengdu, China, to meet the team from Hong Kong Guangdong International, and see the innovative LatticeAx® scribeless cleaving system and FlipScribe® backside scriber, among other LatticeGear solutions.
About LatticeGear LLC
LatticeGear was founded in 2012 by two women with extensive experience in the semiconductor industry who believed passionately that materials cleaving and scribing should be easy and fast. LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® scribeless cleaving system and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom. Learn more at http://www.latticegear.com/.
About Hong Kong Guanghong International Co., Ltd. (GHITC)
GHITC provides sales and service for nanotechnology-related equipment, supporting both semiconductor failure analysis and materials research applications from their headquarters in Shanghai. Their team includes experts in electron microscopy, as well as in the semiconductor industry. Within China, learn more at www.ghitcsh.com.
Efrat Moyal, LatticeGear LLC
Michael Heng, Hong Kong Guanghong International Co., Ltd