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Cleaving Copper C4 Bumps

The LatticeAx was a key component of the sample preparation workflow for preparing copper C4 bumps for examination in the SEM. The results revealed the bump-metallization interface. The process was more cost effective and could be achieved much faster in comparison to using a focused ion beam (FIB) instrument. Read More

SEM image of bump-metallization interface
SEM image of bump-metallization interface

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