Call us at LatticeGear gear has become the leading name in the wafer dicing industry with our novel and fresh approach to developing our own benchtop tools. Suitable for any laboratory or cleanroom, these tools are a far cry from it’s previous counterparts which consisted of large, expensive and cumbersome pieces of machinery. Take advantage of the latest […]
Author Archives: latticegear
Tomorrow’s Miniaturized Devices Need High-Precision Scribing Tools Today
Well aware that the best scribing tools and wafer cleaving methods are steered by substrate hardness and thickness, LatticeGear founder Janet Teshima knows that cleave quality is heavily dependent on scribe angle and depth, as well as the underlying crystal structure. That’s why LatticeGear’s sample preparation solutions focus on streamlining workflows while ensuring high levels […]
Latest-Generation Cleaving Tools Ensure Precision
As devices get slimmer and faster with each new launch, chip manufacturers are under pressure to produce smaller but more powerful components. With transistor density doubling every couple of years, LatticeGear is well aware that high-precision wafer cleaving tools are needed to keep pace with surging technology. Innovative wafer cleaving tools boost accuracy Working closely […]
Only the best Scribing Tools for Cutting-Edge Projects
Accurate sample preparation needs state-of-the-art scribing and cleaving tools. By creating carefully positioned weak points in substrates and wafers, innovative LatticeGear devices ensure that delicate (and expensive!) materials split exactly where required. What is a wafer or substrate? In the miniaturized world of electronics, a wafer (often called a substrate or slice) is a thin […]
High-accuracy Wafer Dicing Equipment from LatticeGear Ensures Top Quality Products
During almost a decade of ground-breaking work in the semiconductor field, LatticeGear developed an innovative line of benchtop tools. Cleanroom compatible, they are designed to handle a broad range of amorphous and crystalline substrates, including: Glass: thick, thin, fused quartz and tempered; Sapphire: used when optical transmission is required in the ultraviolet (above 200 nm) […]
Picking the Best Scribing Tools for Your Project
LatticeGear founder Janet Teshima is well aware that global markets are demanding smaller, faster and cheaper devices. Right in step with this trend, she focuses on developing innovative scribing and cleaving tools that speed up sample preparation. Innovative approach to state-of-the-art scribing tools Scribing is a high precision technique for creating deliberate weak points in […]
Precision Cleaving Tools Ensure the Same Results Every Time
Responding to seemingly insatiable consumer demands for smaller and more powerful devices, chip transistor density doubles every two years. Keeping pace with this drive to miniaturize components while increasing wafer size, LatticeGear specializes in state-of-the-art wafer cleaving tools and technology. Wide range of wafer cleaving tools ensures accuracy, every time A favored vendor accredited by […]
New Tungsten Scribers
New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
LatticeGear welcomes our newest distributor, MSE Supplies
DinoCapture Software Tips for LatticeAx 225 Users
Getting ready for online training I found some useful drawing tools I was not previously aware of. They include a cross-hair tool, cross-hair tool with reticule, and magnification calibrated measurement. Download the pdf using the link below. Let us know if you find these features useful too! Dinolite software for 225 Users