Call us at For obvious reasons, I have spent some time thinking about ways to provide remote training for our customers. I also want to improve our written materials. A few LatticeAx 420 users have asked questions about how to use the software drawing and text features. If you are interested in this document, send me an email […]
Author Archives: latticegear
LatticeGear Joins Columbia University at the Frontiers of Nanoengineering!
Attendees and presenters at Columbia’s Nano Day poster session get a firsthand look at clean, fast and dry cleaving. LatticeAx at the Frontiers of Engineering
Coming to ISTFA? Visit LatticeGear’s CleaveLandia Booth 819
We are expecting to learn the latest in failure analysis techniques and tools at #ISTFA. LatticeGear invites you to CleaveLandia where you can see the latest in scribing and cleaving. For fun we will be taking photos and have bags of gold for the first 100 participants!
LatticeGear Scribing and Cleaving Portfolio to Support Wafer and Sample Preparation of Photonic Materials at MIT
MIT’s Jaramillo group is integrating LatticeGear solutions into their wafer/sample preparation workflow for controlled, damage-free wafer downsizing that is critical to their device fabrication process. Hillsboro, OR; October 15, 2019. The Jaramillo Group at the Massachusetts Institute of Technology has adopted LatticeGear’s complete scribing and cleaving tool portfolio in support of their research on photonic […]
Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom
For Immediate Release Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ yong.sun@yale.edu Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.moyal@latticegear.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]
Join MITnano for Tool Talks and Workshop with LatticeGear
CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]
Cleaving in the NanoFab?
Interested in sample preparation in your cleanroom? Download a fun presentation on cleaving in the cleanroom. Cleaving in the nanofab?
LatticeGear attends UK-China Emerging Technologies Conference
August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference James Watt South (JWS) Building (Room 375) PATENTED Backside Scribing – FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days We encourage you to bring your wafers and samples to try it out! For more information contact, efrat.moyal@latticegear.com
LatticeGear Cleaving Demos @ Stanford SNF July 19
LatticeGear at TechConnect World 2019
LatticeGear participated in the TechConnect World Innovation exposition, June 17-19, Boston, MA. It was a great opportunity to meet with customers and other innovators.