Attendees and presenters at Columbia’s Nano Day poster session get a firsthand look at clean, fast and dry cleaving.  LatticeAx at the Frontiers of Engineering

For Immediate Release

Dr. Yong Sun – Cleanroom Director
Department of Applied Physics,
Yale University
https://www.eng.yale.edu/cleanroom/
yong.sun@yale.edu

Efrat Moyal, Co-Founder
LatticeGear, LLC.
Efrat.moyal@latticegear.com

Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom

Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to precisely prepare their samples using scribing and cleaving and without introducing particles to the cleanroom.

Hillsboro, OR; October 10, 2019. Researchers at the Yale University Cleanroom, a core facility with over 120 users, now are using LatticeGear’s portfolio of scribing and cleaving tools for downsizing and singulating wafers in the cleanroom. Following successful implementation of LatticeGear’s LatticeAx® 300 cleaving system in 2015, the University Cleanroom management added LatticeGear’s FlipScribe®, FlexScribe and Small Sample Cleaver to the tools available for their users.

“In comparison to those big dicing saws, LatticeGear provides a scribing/cleaving solution that’s small in footprint yet extremely capable’” states Dr. Yong Sun, the cleanroom director.
Dr. Sun continues, “Yale University Cleanroom bought the first generation of Ax300. Since the purchase, the dicing saw usage has been reduced to only a handful times every year. The detailed LatticeGear training materials online make it easy to manage the system. Because of our love for the Ax300, we recently purchased two more LatticeGear tools: FlexScribe and FlipScribe. So far, the feedback is quite positive. We can safely say that, with FlexScribe and FlipScribe, users will have a hard time going back to use any hand scribe tool. ”

Yale University Cleanroom was an early adopter for LatticeAx, and with the scribing tool in the cleanroom, it became very convenient for users to prepare a wide variety of samples – including III-V materials, sapphire, silicon and glass – cleanly and with high quality. Many of the users’ samples are preferred not to leave the cleanroom before downsizing or singulating, Dr. Sun believed the LatticeAx provided an excellent alternative to other methods. The LatticeAx has had an increasing number of users since its installation and has proven to be indispensable for creating high quality facets on difficult substrates.

LatticeGear co-founder, Efrat Moyal, says “we are excited to be part of the paradigm shift in the wafer/sample processing workflow at the University Cleanroom of Yale. LatticeGear believes that a good sample preparation workflow is key to successful, speedy and accurate results. By inserting the LatticeGear suite of tools into the process, wafer/sample preparation is removed as a roadblock. We are confident that Yale’s willingness to adopt new tools and methods will lead to breakthroughs in research.”

About
Yale University Cleanroom at the Department of Applied Physics
The University Cleanroom is a Core Facility administrated by the Department of Applied Physics. It is operated as an internal service provider to the Yale research community. The University Cleanroom serves over 120 graduate students and researchers across campus.

LatticeGear, LLC.
LatticeGear is committed to removing sample preparation as a barrier to developing advanced devices using new materials and processes. The flagship products, LatticeAx®, FlipScribe® and FlexScribe use novel scribing and cleaving technology to enable fast, clean downsizing and cross-sectioning for a variety of materials including glass, sapphire, III-V, SiC and silicon, from 300-mm wafers to 1-mm pieces.

CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES

Thursday, September 5, 2019

9:30am–10:30am
12-0168, MIT.nano (basement level), Building 12
60 Vassar Street (rear)
Cambridge, MA

Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room temperature method that maintains all the parts without altering the process layers. The challenge with standard cleaving is the control and repeatability over quality and accuracy outcome. Therefore, we often resort to alternative methods, like dicing saw and FIB milling. LatticeGear focuses its entire product portfolio on cleaving technologies that challenges one assumptions about cleaving and scribing capabilities. The patented scribeless cleaving technology initiates the cleave with only microline indentation, no scribing and no particles, which makes it cleanroom compatible. The unique, patented scribing tool scribes on the backside to protect frontside features, ideal for clean, surface touchless downsizing. These technologies coupled with correct planning of the substrate preparation workflow based on the substrate characteristics and the outcome required enable downsizing and cross-sectioning for a variety of materials including glass, sapphire, III-V, SiC and silicon, and 300-mm wafer to 1-mm die. It even cleaves freestanding structures deposited by e-beam lithography and <100-µm thin substrate.

Join the workshop and learn how to handle your substrates successfully.

Register Now