For Immediate Release
Dr. Yong Sun – Cleanroom Director
Department of Applied Physics,
Efrat Moyal, Co-Founder
Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom
Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to precisely prepare their samples using scribing and cleaving and without introducing particles to the cleanroom.
Hillsboro, OR; October 10, 2019. Researchers at the Yale University Cleanroom, a core facility with over 120 users, now are using LatticeGear’s portfolio of scribing and cleaving tools for downsizing and singulating wafers in the cleanroom. Following successful implementation of LatticeGear’s LatticeAx® 300 cleaving system in 2015, the University Cleanroom management added LatticeGear’s FlipScribe®, FlexScribe and Small Sample Cleaver to the tools available for their users.
“In comparison to those big dicing saws, LatticeGear provides a scribing/cleaving solution that’s small in footprint yet extremely capable’” states Dr. Yong Sun, the cleanroom director.
Dr. Sun continues, “Yale University Cleanroom bought the first generation of Ax300. Since the purchase, the dicing saw usage has been reduced to only a handful times every year. The detailed LatticeGear training materials online make it easy to manage the system. Because of our love for the Ax300, we recently purchased two more LatticeGear tools: FlexScribe and FlipScribe. So far, the feedback is quite positive. We can safely say that, with FlexScribe and FlipScribe, users will have a hard time going back to use any hand scribe tool. ”
Yale University Cleanroom was an early adopter for LatticeAx, and with the scribing tool in the cleanroom, it became very convenient for users to prepare a wide variety of samples – including III-V materials, sapphire, silicon and glass – cleanly and with high quality. Many of the users’ samples are preferred not to leave the cleanroom before downsizing or singulating, Dr. Sun believed the LatticeAx provided an excellent alternative to other methods. The LatticeAx has had an increasing number of users since its installation and has proven to be indispensable for creating high quality facets on difficult substrates.
LatticeGear co-founder, Efrat Moyal, says “we are excited to be part of the paradigm shift in the wafer/sample processing workflow at the University Cleanroom of Yale. LatticeGear believes that a good sample preparation workflow is key to successful, speedy and accurate results. By inserting the LatticeGear suite of tools into the process, wafer/sample preparation is removed as a roadblock. We are confident that Yale’s willingness to adopt new tools and methods will lead to breakthroughs in research.”
Yale University Cleanroom at the Department of Applied Physics
The University Cleanroom is a Core Facility administrated by the Department of Applied Physics. It is operated as an internal service provider to the Yale research community. The University Cleanroom serves over 120 graduate students and researchers across campus.
LatticeGear is committed to removing sample preparation as a barrier to developing advanced devices using new materials and processes. The flagship products, LatticeAx®, FlipScribe® and FlexScribe use novel scribing and cleaving technology to enable fast, clean downsizing and cross-sectioning for a variety of materials including glass, sapphire, III-V, SiC and silicon, from 300-mm wafers to 1-mm pieces.