Call us at New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
Tag Archives: Cleaving
See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018 Visit LatticeGear- Booth 86 (Nano Technology Solutions) At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and […]
Electron Microscopy Sciences and LatticeGear are exhibiting at M&M
Demos of the LatticeAx 420 and the FlipScribe going on NOW in Booth 616- M&M Baltimore! Contact efrat.moyal@latticegear.com to set up a demo. Share on Linkedin
Dry, Particle-Free Wafer Downsizing in the Cleanroom
Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper. First you may ask “Why implement a cleaving process in the cleanroom?”: Here is what the Operations Director of a National Nanofabrication Facility had to say, “Here at […]
LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving […]
Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand
LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]
Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures
Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research […]
LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute
Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can […]
High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates
At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an […]