Call us at New in 2021, LatticeGear has a line of Tungsten Carbide Cutters. These hand tools have 5” long handle and a tungsten carbide cutting wheel for creating an accurate and clean pre-cleave scribe on wafers, especially Glass or Silicon. For some material combinations, these cutters will create less damage and particle contamination than pointed tip diamond […]
Tag Archives: Scribing
See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018 Visit LatticeGear- Booth 86 (Nano Technology Solutions) At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and […]
LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016
LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin […]
Cleaving a silicon (111) wafer with the FlipScribe scriber
Here is a fun instructional video showing the downsizing of a (111) silicon wafer into quarters. We used the FlipScribe backside scribing machine. See also Cleaving a (111) silicon wafer along crystal planes