Call us at LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]
Category Archives: Cleaving
Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures
Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research […]
LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute
Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can […]
High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates
At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an […]
LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016
LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin […]
Cleaving a silicon (111) wafer with the FlipScribe scriber
Here is a fun instructional video showing the downsizing of a (111) silicon wafer into quarters. We used the FlipScribe backside scribing machine. See also Cleaving a (111) silicon wafer along crystal planes
LatticeAx used to prepare GaN m-plane end facets
Researchers at Yale University developed a novel conductivity based selective electrochemical etching to introduce nanometer sized pores into GaN. The fabrication process for the edge-emitting laser cavity samples included cleaving with the LatticeAx 420, diamond-tipped cleaving tool to form the GaN m-plane end facets. See the paper in the Proc. of SPIE Vol. 9748 97480Q-7. For […]
LatticeGear introduces the NEW LatticeAx 225
The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″). The new design enables magnification and focus to be changed without mechanical adjustments to the microscopes working distance. The perfect, indent and cleaving system with microscope […]