Call us at LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand Beaverton, Oregon; May 22, 2017: LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ). “NanoTechnology Solutions’ […]
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LatticeGear is heading to Semicon SEA
LatticeGear is heading to Semicon SEA to participate in the workshop: Effective Failure Analysis in the age of Internet-of-Things (IoT) chaired by Dr. GOH Szu Huat of Global Foundries, Singapore Pte Ltd. Learn more about the workshop and register here https://lnkd.in/eaXPYN3 Here is the conference abstract: In today’s age of IoT proliferation, people are more […]
Niels Bohr Institute Researchers Successfully Cleave Delicate Nanostructures
Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research […]
LatticeAx Cleaving Tool In the Cleanroom at PennState Materials Research Institute
Did you know that you can use the LatticeAx indent and cleaving tool at the PennState Materials Research Institute? The LatticeAx 420 is located in the Nanofabrication Laboratory cleanroom. It has improved the success rates for preparing cleaved samples in comparison to manual techniques using handheld tools. The LatticeAx is simple to use and can […]
Scribing and Cleaving Samples Into 1 mm Wide Strips
Some analytical instruments can only accept small samples and with limited height. Sample preparation by scribing and cleaving is often the best solution. LatticeGear’s scribing and cleaving tools are used to prepare narrow samples for high resolution SEM and STEM. The video shows two methods of preparing 1 mm wide strips. One narrow sample was […]
LatticeGear Introduces Small Sample Cleaving Pliers
Have you had trouble cleaving small samples? LatticeGear introduces our Small Sample Cleaving Pliers and Scribing and Cleaving Kit for Small Samples. The custom handheld cleaving pliers can cleave samples into pieces from 1 – 30 mm with soft nylon covered jaws that do not damage your sample. These new accessories can be purchased on […]
High quality downsizing by LatticeAx cleaving improves planar polishing accuracy and success rates
At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an […]
LatticeGear demonstrated the new LatticeAx 225 at ISTFA 2016
LatticeGear exhibited at ISTFA 2016 in Fort Worth, Texas, November 8-9. A full suite of cleaving and scribing tools was demonstrated. The tools included the new LatticeAx 225 high accuracy indenting and cleaving system, small sample pliers and the FlipScribe backside scriber. LatticeGear also presented a presentation called “Using Micro line indentation to downsize thin […]
LatticeGear Receives Business Certifications
LatticeGear, LLC. has been certified! The following certifications were granted: Emerging Small Business (ESB) Women Business Enterprise (WBE) Minority Business Enterprise (MBE) LatticeGear’s certification ID is 10516. Thanks much to the State of Oregon and Marta Tarantsey for coaching us through the certification process. Please contact us for copies of the certification letters.
Cleaving a silicon (111) wafer with the FlipScribe scriber
Here is a fun instructional video showing the downsizing of a (111) silicon wafer into quarters. We used the FlipScribe backside scribing machine. See also Cleaving a (111) silicon wafer along crystal planes