Call us at June 28th, 2021: Lattice Gear, LLC announces that they have sold their product, manufacturing and associated assets to Ted Pella, Inc. Janet Teshima, the owner and cofounder of LatticeGear signed the agreement with Tom Pella, owner and president of Ted Pella, Inc., on June 23rd, 2021. LatticeGear, LLC will cease normal business operations on July […]
Category Archives: News
LatticeGear welcomes our newest distributor, MSE Supplies
LatticeGear Joins Columbia University at the Frontiers of Nanoengineering!
Attendees and presenters at Columbia’s Nano Day poster session get a firsthand look at clean, fast and dry cleaving. LatticeAx at the Frontiers of Engineering
Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom
For Immediate Release Dr. Yong Sun – Cleanroom Director Department of Applied Physics, Yale University https://www.eng.yale.edu/cleanroom/ yong.sun@yale.edu Efrat Moyal, Co-Founder LatticeGear, LLC. Efrat.moyal@latticegear.com Yale Adds New Scribing and Cleaving Solutions to Downsize Wafers and Singulate Devices in the University Cleanroom Implementing the full suite of LatticeGear solutions in the University Cleanroom allowed researchers to […]
Join MITnano for Tool Talks and Workshop with LatticeGear
CLEAVING TECHNOLOGIES TO DOWNSIZING, SINGULATING AND CROSS-SECTIONING SUBSTRATES Thursday, September 5, 2019 9:30am–10:30am 12-0168, MIT.nano (basement level), Building 12 60 Vassar Street (rear) Cambridge, MA Substrate downsizing, singulating and cross-sectioning is a common practice for process development, experiments and analysis. Cleaving is the most desired technology to use as it is the only dry, clean, room […]
LatticeGear attends UK-China Emerging Technologies Conference
August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference James Watt South (JWS) Building (Room 375) PATENTED Backside Scribing – FlipScribe and PATENTED cleaving with no scribing – LatticeAx – Cleanroom compatible, will be demonstrated throughout the 2-days We encourage you to bring your wafers and samples to try it out! For more information contact, efrat.moyal@latticegear.com
Live Demos at the Yale Applied Physics User Meeting
Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside […]
Are You Ready For ISTFA?
LatticeGear has you covered from all sides! Booth 220, Phoenix Convention Center October 30-31 Sign up for Tools of the Trade to get a Preview of our new products including the NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm) The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and […]
See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018 Visit LatticeGear- Booth 86 (Nano Technology Solutions) At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and […]
LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving […]