Call us at I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….
Category Archives: Advanced Materials
Live Demos at the Yale Applied Physics User Meeting
Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside […]
See Live, LatticeGear Scribing and Cleaving Demos at JSAP and IMC19
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018 Visit LatticeGear- Booth 86 (Nano Technology Solutions) At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and […]
Electron Microscopy Sciences and LatticeGear are exhibiting at M&M
Demos of the LatticeAx 420 and the FlipScribe going on NOW in Booth 616- M&M Baltimore! Contact efrat.moyal@latticegear.com to set up a demo. Share on Linkedin
Dry, Particle-Free Wafer Downsizing in the Cleanroom
Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper. First you may ask “Why implement a cleaving process in the cleanroom?”: Here is what the Operations Director of a National Nanofabrication Facility had to say, “Here at […]
Cleaving with LatticeGear Cleanbreak Pliers
When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur! LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to; decide which type of […]
LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving […]
Get Rewarded at Microscopy and Microanalysis
Attend “Cleaving and Scribing Reinvented” in Sydney Australia
LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!” How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. […]
Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]