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Dry, Particle-Free Wafer Downsizing in the Cleanroom
Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper. First you may ask “Why implement a cleaving process in the cleanroom?”: Here is what the Operations Director of a National Nanofabrication Facility had to say, “Here at […]
View another cleaving solution from LatticeGear!
Watch the LatticeAx cleaving system cleanly cleave glass slides and very thin cover slips. Contact us with your application and we will send you a free cleaving gift.
Cleaving with LatticeGear Cleanbreak Pliers
When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur! LatticeGear has produced a HOW TO USE CLEAVING PLIERS video showing how to; decide which type of […]
Are you interested in why the LatticeScriber is unique?
The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements. Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber? CLICK Here to buy!
LatticeGear and V-TEK Share Cleaving and Scribing Insights with Taiwan Universities
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving […]
Get Rewarded at Microscopy and Microanalysis
Attend “Cleaving and Scribing Reinvented” in Sydney Australia
LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!” How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. […]
Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]
LatticeGear LLC Announces New Representation in China
LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017. Beaverton, Oregon, USA […]