Call us at The glass slide above was cleaved with the LatticeAx 120. The LatticeAx produces clean edges without creating fractures. This method was used to prepare samples for further analysis using and AFM of samples mounted on the surface of the slide. This technique was used by researchers at Penn State to downsize a glass slide containing carefully prepared […]
Monthly Archives: June 2016
Cleaving Etched TSV Structures
Optical and SEM images of etched TSVs. Note the clean cleave with mirror finish. The long cleave enables inspection of many vias. SEM image at 10kV in SE mode.
Cleaving Photoresist
Photoresist, because it is soft, makes it difficult to cross section mechanically or with the FIB. The best solution is to cleave the sample and image it directly in the SEM. This makes the LatticeAx the perfect tool for sample preparation of photoresist cross sections. The resist structure is not changed in the process and […]
Cleaving a Die Attached to a Host Substrate
The original die was depackaged, too thin to handle any other way, the die was attached to a host substrate. The LatticeAx was used to downsize the sample in preparation for further processing. The indent was created on the host substrate. No special process was used to indent and cleave the sample.
Downsizing die to fit your Prober or SEM or FIB sample holder
Downsize die to fit your Prober, SEM or FIB sample holder without any “cracking” risk Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the […]