Call us at LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!” How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. […]
Monthly Archives: July 2017
Global Foundries Develops A Controlled Mechanical Method for MEMS Decapsulation
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation. Download the Poster from IPFA 2107 […]