Semiconductor

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n-probe stub — Preparing samples for probing, SEM or FIB

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300 mm wafer cleaved by the LatticeAx — Downsizing wafers with cleaving and scribing tools

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Cleaved copper bumps — Cleaving Copper Bumps

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Cleaving Samples with Rotated Lithography

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4x3mm sample prepared using the LatticeAx

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Cleaving electronic structures fabricated at 45 degrees to Silicon (100)

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LatticeAx diamond indenter separating the MEMS device from the lid.

[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text][/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]Publications (contact lg@latticegear.com for copies of these publications)[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_column_text]Global Foundries[/vc_column_text][/vc_column][vc_column width=”3/4″][vc_column_text]A Controlled Mechanical Method for MEMS Decapsulation (poster)[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_column_text]University of Copenhagen:[/vc_column_text][/vc_column][vc_column width=”3/4″][vc_column_text]Successful Cleaving of Delicate Nanostructures[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_column_text]Solid State Technology: [/vc_column_text][/vc_column][vc_column width=”3/4″][vc_column_text]From Transistors to Bumps: Preparing SEM Cross-Sections by Combining Site-specific Cleaving and Broad Ion Beam Milling[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_column_text]EDFA Journal:[/vc_column_text][/vc_column][vc_column width=”3/4″][vc_column_text]Cleaving Breakthrough: A New Method Removes Old Limitations[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_btn title=”Advanced Materials Use Cases” color=”info” link=”url:https%3A%2F%2Flatticegear.com%2Fnew%2Fuse-cases-and-publications%2Fadvanced-materials%2F||”][/vc_column][/vc_row]