News and Events
September 21, 2018
LatticeGear to Present and Exhibit at ESREF October 2-4, 2018
Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.
See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23
LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here
August 20, 2018
IMC19- 19th International Microscopy Congress Sydney, Australia September 9-14, 2018
Visit LatticeGear- Booth 86 (Nano Technology Solutions)
At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon.. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes without touching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.
August 17, 2018
JSAP 2108, September 18-21, 2018, Nagoya Japan
Visit LatticeGear at Hisol booth
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.
DO NOT MISS, LatticeGear Luncheon Seminar: The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE
June 27, 2017 LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research
LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.
Michael Heng, Hong Kong Guanghong International Co., Ltd
May 22, 2017 LatticeGear Partners with NanoTechnology Solutions to offer cleaving and scribing solutions in Australia and New Zealand
LatticeGear, LLC. and NanoTechnology Solutions have announced a distribution agreement that brings LatticeGear’s innovative cleaving and scribing solutions to sample preparation workflows in electronics and materials research labs in Australia and New Zealand (ANZ).
July 18, 2017 LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”
How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is is offered at no cost. RSVP to: firstname.lastname@example.org
August 31, 2016 LatticeGear introduces the NEW LatticeAx 225
The NEW LatticeAx 225 integrates an ultra-stable indent and cleaving platform with the 120 base indent and cleaving system. This system is easy to operate and compact ( platform is 13″x11″). READ MORE
See LatticeGear at ESREF 2016 September 19-22, Booth 18
The conference will take place at HÄNDEL-HALLE located in the immediate centre of Halle City (vis-à-vis Hallmarkt)
See LatticeGear at IPFA 2016 July 19-21 Booth A06
This year IPFA, 23rd International Symposium on the Physical Failure Analysis of Integrated Circuits is located in Singapore at the Marina Bay Sands Hotel. Visit LatticeGear Booth A06 for live demonstrations of the LatticeAx 420, FlipScribe, Small Sample Cleaver and more!