Hey FlipScribe users? Watch this short movie to see the new holder we have developed for the FlipScribe. It grips samples from 5-25mm and can be used as a holder to grab the sample prior to cleaving. Contact us at firstname.lastname@example.org to get your new holder.
Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact email@example.com for a copy of the paper.
First you may ask “Why implement a cleaving process in the cleanroom?”:
Here is what the Operations Director of a National Nanofabrication Facility had to say,
“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”
LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.
LatticeGear wishes to thank the University of Sydney (Ethel Cabrera Ilagan) and Penn State University for their assistance with this study.
When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!
The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements.
Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber?
Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization. This type of lecture is not part of any curriculum, yet fundamental for research and development.
It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.
Please contact LatticeGear at firstname.lastname@example.org if you would like to schedule a seminar at your industrial or academic laboratory.
LatticeGear and NanoTechnology Solutions Partner to Present “Cleaving and Scribing Reinvented!”
How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: email@example.com
Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.
Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.