August 21-22 at University of Glasgow, UK-China Emerging Technologies Conference
James Watt South (JWS) Building (Room 375)
We encourage you to bring your wafers and samples to try it out!
For more information contact, email@example.com
LatticeGear participated in the TechConnect World Innovation exposition, June 17-19, Boston, MA. It was a great opportunity to meet with customers and other innovators.
Yale’s School of Engineering and Applied Physics (SEAS) will host their Cleanroom User Meeting on January 22, 2019. Share your experience with users, and vendors in the field. Hear Efrat Moyal talk about “Cleaving Science” and learn how to use the best methods and tools to prepare samples for processing and characterization. Get the inside scoop by downloading LatticeGear’s article on cleaving in the cleanroom!
LatticeGear has you covered from all sides!
Booth 220, Phoenix Convention Center October 30-31
Sign up for Tools of the Trade to get a Preview of our new products including the
NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm)
The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and LatticeAx® scribing and cleaving solutions.
The FlexScribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.
LatticeGear to Present at ESREF
Do not miss, LatticeGear talk at the Industrial Session on Tuesday at 2:20pm: Scribing and CLEAVING SOLUTIONS in Nanofab and Research – technologies, workflows and uses cases.
See the LatticeAx and FlipScribe patented technologies in the Omni Booth #23
LatticeGear will demonstrate its patented technologies at ESREF 2018, Oct 2-4 in Aalborg, Denmark – Omni Booth #23: For general information about ESREF Click here
Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber
Scribeless cleaving method for glass, sapphire, III-V, SiC and silicon. Surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.
Online Reservation Deadline : Noon on September 10 (Mon.), 2018 – https://meeting.jsap.or.jp/english/luncheon-seminars