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Cleaving a Die Attached to a Host Substrate


Cleaving a die attached to a host substrate

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Cleaving Stacked Die
Cleaving Stacked Die

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The original die was depackaged, too thin to handle any other way, the die was attached to a host substrate. The LatticeAx was used to downsize the sample in preparation for further processing. The indent was created on the host substrate. No special process was used to indent and cleave the sample.